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( a ) Micro electro mechanical system-differential mobility particle sizer (MEMS-DMPS) with sensor printed circuit board (PCB) vertically plugged between the main board and a 3D-printed air-intake socket with a miniature fan (10 × 10 × 2 mm 3 , HY10A03A, SEPA Europe GmbH, Eschbach, Germany), which provides a bottom-to-top airflow in parallel through 4 × 8 µFCs in the MEMS die. The (replaceable) sensor PCB is horizontally pressed in between two miniature multilayer piezo linear actuators (PL055.3, PI Ceramic GmbH, Lederhose, Germany) using mounting brackets connected to the main board. The piezo actuators are operated in differential mode with an excitation voltage V ac . ( b ) Photograph of the sensor PCB with the MEMS die (8 × 8 mm 2 ) glued on a carrier PCB (40 × 40 mm 2 ) and connected via soldered Cu wires. ( c ) Scanning electron microscopy (SEM) photograph of an array of 8 PMC-µFCs sensors of identical design, a reference structure and its contact lines to the bridge ( V dd ) and sampling voltage (HV) and ground (GND). ( d ) Electric block diagram of the sensor PCB with further read-out components and their interconnections on the main board including an instrumental amplifier (INA217, TI, USA) followed by a Lock-in amplifier (MFLI, Zurich Instruments) and BNC connectors for read-out of the measurement signal, the excitation voltage ( V ac ) and V dd as well as the HV supply pin and GND.

Journal: Sensors (Basel, Switzerland)

Article Title: Ultrafine Aerosol Particle Sizer Based on Piezoresistive Microcantilever Resonators with Integrated Air-Flow Channel

doi: 10.3390/s21113731

Figure Lengend Snippet: ( a ) Micro electro mechanical system-differential mobility particle sizer (MEMS-DMPS) with sensor printed circuit board (PCB) vertically plugged between the main board and a 3D-printed air-intake socket with a miniature fan (10 × 10 × 2 mm 3 , HY10A03A, SEPA Europe GmbH, Eschbach, Germany), which provides a bottom-to-top airflow in parallel through 4 × 8 µFCs in the MEMS die. The (replaceable) sensor PCB is horizontally pressed in between two miniature multilayer piezo linear actuators (PL055.3, PI Ceramic GmbH, Lederhose, Germany) using mounting brackets connected to the main board. The piezo actuators are operated in differential mode with an excitation voltage V ac . ( b ) Photograph of the sensor PCB with the MEMS die (8 × 8 mm 2 ) glued on a carrier PCB (40 × 40 mm 2 ) and connected via soldered Cu wires. ( c ) Scanning electron microscopy (SEM) photograph of an array of 8 PMC-µFCs sensors of identical design, a reference structure and its contact lines to the bridge ( V dd ) and sampling voltage (HV) and ground (GND). ( d ) Electric block diagram of the sensor PCB with further read-out components and their interconnections on the main board including an instrumental amplifier (INA217, TI, USA) followed by a Lock-in amplifier (MFLI, Zurich Instruments) and BNC connectors for read-out of the measurement signal, the excitation voltage ( V ac ) and V dd as well as the HV supply pin and GND.

Article Snippet: Furthermore, two miniature multilayer piezo linear actuators (PL055.3, PI Ceramic GmbH, Lederhose, Germany) are arranged under force-closure between the PCB and the mounting brackets.

Techniques: Electron Microscopy, Sampling, Blocking Assay